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From schematics to reliable products: 5 mistakes hardware engineers should never make

From schematics to reliable products: 5 mistakes hardware engineers should never make

2026-08-29

hardware development From schematics to mass production, some mistakes, once made, can lead to anything from burnt-out boards to recalls.

Analysis of PCB Warpage

Analysis of PCB Warpage

2026-09-03

Anyone working in hardware, PCB design, or SMT processing has likely encountered the pitfalls of PCB warpage.What might seem like minor board bending or warping can have disastrous consequences: Component misalignment, cold solder joints, BGA voids, "tombstoning," misaligned screw holes, and cracking due to stress during final assembly—often leading to mass rework or the scrapping of entire batch

Why do SerDes receivers (RX) require CTLE, DFE, and CDR?

Why do SerDes receivers (RX) require CTLE, DFE, and CDR?

2026-09-04

Which components on a PCB should not be coated with conformal coating?

Which components on a PCB should not be coated with conformal coating?

2026-09-08

When dealing with conformal coating, many hardware engineers' first reaction is: "Wouldn't it suffice to just spray the entire PCB?" Actually, that’s not quite the case! While conformal coating does indeed enhance a PCB's resistance to moisture, salt spray, dust, and corrosive environments, it is essentially an insulating protective film. The problem lies precisely here: some components require

With so many diode models available, how exactly do you choose?

With so many diode models available, how exactly do you choose?

2026-09-11

A diode might look like a simple component with just two leads,but if you underestimate it, you’re likely to run into trouble. In this article, we cover everything from underlying principles to technical specifications, and from model classifications to practical selection, finally providing you with a ready-to-use checklist.

PCB Micro-via Back-drilling Technology Research

PCB Micro-via Back-drilling Technology Research

2026-09-15

Back-drilling, a critical process for removing unnecessary copper from through-holes and controlling stub length, directly impacts high-speed signal integrity. Since back-drilling typically occurs after through-hole metallization, the processing conditions differ fundamentally from standard through-hole drilling; consequently, issues such as hole clogging, positioning accuracy, and stub length co

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