PCBA capability
| Item | Batch | Sample | ||||||
| Conventional process | Unconventional process | Conventional process | Unconventional process | |||||
| SMT | PCB data | Length*width（L*W） | Min | L≥50，W≥50 | L＜50 | 50*50 | L＜50 | |
| Max | L≤460,W≤460 | L＞460，W＞400 | L≤450,W≤350 |
450＜L＜800
350＜W＜400
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| Thick（T） | Thinest | 0.5 | T＜0.5 | 0.8 | T＜0.8 | |||
| Thickest | 4.5 | T＞4.5 | 2 | T＞2 | ||||
| component data | Outside size | Min | 0.6*0.3 | 0.3*0.15 | 0.6*0.3 | 0.3*0.15 | ||
| Max | 200*125 | 200*125 | 200*125 | 200*125 | ||||
| Thickest | T≤6.5 | 6.5≤T≤125 | T≤6.5 | 6.5≤T≤25 | ||||
| QFP/SOP/SOJ etc pins | Min PIN dis | 0.4 | 0.3≤pitch＜0.5 | 0.4 | 0.3≤pitch＜0.4 | |||
| CSP/BGA | Min ball distance | 0.5 | 0.3≤pitch＜0.5 | 0.5 | 0.3≤pitch＜0.5 | |||
| DIP | PCB data | Length*width（L*W） | Min | L≥50W≥30 | L＜50 | L≥50.W≥30 | L＜50 | |
| Max | L≤500,W≤300 | L≥500,W≥300 | L≤500,W≤300 | L≥500,W≥300 | ||||
| Thick（T） | Thinest | 0.8 | T＜0.8 | 0.8 | T＜0.8 | |||
| Thickest | 2 | T＞2 | 0.2 | T>2 | ||||