Rigid PCB capability
| Number | Item | Sample technical capability | Batch technical capability |
| 1 | Plate | FR-4 High TG/PTFE/Ceramic PCB/Polyimide | FR-4 High TG/PTFE/Ceramic PCB/Polyimide |
| 2 | Min Outline | 5mm*5mm | |
| 3 | Max Outline | 609mm*889mm | |
| 4 | Min base copper | 1/3 OZ (12um) | 1/3 OZ (12um) |
| 5 | Max finished copper | 6 OZ | 6 OZ |
| 6 | Min trace width/spacing | ≥3/3mil (0.076mm) 4/4mil(finished copper 1oz)，5/5mil(finished copper 2oz)8/8mil(finished copper 3oz) | |
| 7 | |||
| 8 | Mini distance from hole to inner conductor | 6 mil/0.15mm | |
| 9 | Min spacing from hole to outer conductor | ||
| 10 | Min via hole annular ring | 3 mil/0.075mm | |
| 11 | Min PTH hole solder ring | 5 mil/0.125mm | |
| 12 | Min BGA PAD | 8 mil/0.2mm | |
| 13 | Min finished hole size | 0.15mm | |
| 14 | Mechanical hole Diameter（finished） | 0.15-0.62mm(Corresponding drilling tool 0.15-6.3mm) | |
| 15 | Mechanical buried blind hole≤0.3mm(Corresponding drilling tool 0.35mm) | ||
| 16 | Via in PAD green oil plug hole drilling diameter≤0.45mm(Corresponding drilling tool 0.55mm) | ||
| 17 | Min. connected hole 0.35mm(Corresponding drilling tool 0.45mm) | ||
| 18 | Half plated hole min hole 0.30mm(Corresponding drilling tool 0.40mm) | ||
| 19 | Max. board thickness for mechanical drilling | Hole diameter：0.1/0.15/0,2mm Max board thick：0.8mm/1.5mm/2.5mm | |
| 20 | Drilling - hole position tolerance | ±2mil | |
| 21 | Drill-NPTH hole minimum tolerance of hole diameter | ±2mil | |
| 22 | Drill hole - no solder hole tolerance | ±2mil | |
| 23 | Drilling - Countersunk hole depth tolerance | ±0.15mil | |
| 24 | Drilling - Countersunk hole width tolerance | ±0.15mil | |
| 25 | Maximum board thickness to hole ratio | 20:01 | 12:01 |
| 26 | Minimum half-hole diameter | 0.4mm | 0.5mm |
| 27 | Minimum insulation layer thickness | 2mil | |
| 28 | soldermask color | green/white/black/blue/red/purple/matte green/matte black | |
| 29 | Surface treatment | ENIG/HASL/HASL-LF/OSP/IMMERSION SILVER/IMMERSION SN/PLATE GOLD/PLATE SILVER | |
| 30 | Minimum half-hole diameter | 0.4mm | 0.45mm |
| 31 | Gold finger thick | 10-30u | 10-30u |
| 32 | Countersunk hole diameter | 0.8mm-3.0mm | 0.8mm-3.0mm |
| 33 | Via in PAD hole diameter | 0.15mm-3.0mm | 0.15mm-3.0mm |
| 34 | Press fit hole tolerance | PTH/NPTH±0.05mm | |
| 35 | Impedance hole tolerance | 8% | 10% |