Plate type

Aluminum substrate/copper substrate/thermal separation copper substrate/copper aluminum composite plate

Board warp

0.5%（size 350*350）

Plate type

Bendable aluminum

Bending angle

30° 45° 90° Arbitrary bending

Thermal conductivity

1.0W/1.5W/2.0W/4.0W/8.0W/122W

Resistant voltage

AC1500-4000V

Plate thickness

0.2-5.0MM

Copper thick

25um 35um 70um 105um

Surface finish

HASL-LF/ENIG/OSP/IMMERSION TIN

Forming method

CNC Punch V-CUT Laser cut

Max size

1500MM*500MM

Outside tolerance

CNC：±0.1-0.15MM   Punch：±0.125MM

Min size

5MM*5MM

Outside tolerance

Laser cut：±0.05MM

Min trace width

0.1MM(4mil)

Production Process

Exposure process, thermoelectric separation process

Min trace space

0.1MM(4mil)

Lead time

sample：3-6days；batch：8-12days

Min hole

∮0.8MM

E-Test

100%