Cell Phone (Mobile phone) HDI PCB PROCESS

Do you want to know how the circuit boards in your cell phone are made?

I'll use 3D diagrams explanations and the simplest, easiest-to-understand language to show you our company's manufacturing process.

Circuit boards are mainly composed of “copper” and “resin”.

1. Pre-treatment of the copper surface using laser processing.

2. Using “laser processing” drill holes with “a diameter of approximately 0.1mm” in the copper foil and resin.

3. Plating with copper, followed by filling the holes.

4. Through “chemical treatment”, the copper foil forms the “Continuous circuit” .

5. Resin and copper foil are pressed together on both sides.

6. The same process is repeated to form the circuit.

7. “A protective film” is applied, completing the process.

The resulting circuit board, by conducting electricity through the copper circuit, connects electronic components, performing the function of wiring and enabling all possibilities in all fields.