KEY TECHNOLOGY(HK)CO. ,LIMITED
  • Home
  • Products
    • PCBA
    • Rigid PCB
    • HDI PCB
    • Rigid Flex PCB
    • Flex PCB
    • High Frequency PCB
      • Rogers PCB
      • Isola PCB
      • Arlon PCB
      • Nelco PCB
      • Taconic PCB
      • Teflon PCB
      • Neltec PCB
    • Metal Core PCB
      • Aluminium PCB
      • Copper PCB
    • Ceramic PCB
    • Laser Stencil
    • Reverse engineering
    • Purchasing components
  • Capability
    • PCBA capability
    • Rigid PCB capability
    • HDI PCB Capability
    • Rigid Flex PCB Capability
    • Flex PCB Capability
    • High Frequency PCB Capability
    • Metal Core PCB Capability
    • Ceramic PCB Capability
  • Equipment
    • PCB Equipment
    • PCBA Equipment
  • About us
  • Blogs
  • Feedback
  • Contact us

Blogs

  1. Home
  2. Blogs
  3. Information sharing RF PCB layout and ci...

Information sharing RF PCB layout and circuit optimization

[Read more] 2-layer PCB manufacturing costs will be lower than 4-layer PCB, but PCB thickness should not exceed 0.8mm - 1.00mm, and the transmission line does not have enough reference distance, the width will become quite large. Like many Rogers RF PCB boards are very thin, generally divided into cavity design, not suitable for large sizes. 4-layer PCB is usually 1.6mm thick, if not on the surface to go RF Signal, can be in the middle layer to go RF line, characteristic impedance of 50Ω.

General RF single-chip transceiver program PCB Layout when the double-layer board and 4-layer board layout is predominant, today to see what specific differences.
Cost - the same size, 2-layer board is cheaper

2. PCB thickness

2-layer PCB manufacturing costs will be lower than 4-layer PCB, but PCB thickness should not exceed 0.8mm - 1.00mm, while the transmission line does not have sufficient reference distance, the width will become quite large. Like many Rogers RF PCB boards are very thin, generally divided into cavity design, not suitable for large sizes. 4-layer PCB is usually 1.6mm thick, if you do not go RF Signal on the surface, you can go RF lines in the middle layer, the characteristic impedance is 50Ω.


3. EMI





4-layer board as shown above, from the top down are Signal, GND, POWER, GND 4-layer board, placed between the 2 GND a power layer can be between the power and ground to achieve a uniform distribution of RF decoupling capacitance and low impedance at high frequencies. power Plane surrounded by vias, thus preventing any radiation emitted from the edge of the board. As can be seen from the diagram above, the power plane is suppressed at the final stage of the TX matching network to prevent any parasitic coupling caused by radiated and reflected energy at this stage (this part is particularly important to note, as the signal is strongest when transmitting and peripheral signals tend to couple the transmit signal and thus create parasitic modulation).


In contrast, the 2-layer board does not have enough space for a separate power supply layer and full GND, the radiated emission signal cannot be effectively suppressed and EMI is relatively poor.





As shown in the diagram above, the power supply routing on the component is very thick in order to present as low an impedance as possible. The large ground area on this side of the board provides a low decoupling impedance path. Wherever possible, try to have a full GND plane underneath.


4. FCC Certification


Every electronic device sold or manufactured in the USA must be officially approved by the Federal Communications Commission (FCC). 4-layer boards have relatively good EMI and are more likely to pass the Part 15 test for intentional/unintentional radiation from electronic products or devices.

Related News

High-speed PCB general layout, circuit principles

High-speed PCB general layout, circuit principles

Magnetic Circuit Probe

Magnetic Circuit Probe

Popularization: one second to read the electronic components packaging

Popularization: one second to read the electronic components

How to choose the right stacking scheme when designing PCBs

How to choose the right stacking scheme when designing PCBs

PCB impedance calculation

PCB impedance calculation

Analysis and discussion on the causes of IC solder joint falling off

Analysis and discussion on the causes of IC solder joint fal

Product Categories

  • PCBA
  • Rigid PCB
  • HDI PCB
  • Rigid Flex PCB
  • Flex PCB
  • High Frequency PCB
    • Rogers PCB
    • Isola PCB
    • Arlon PCB
    • Nelco PCB
    • Taconic PCB
    • Teflon PCB
    • Neltec PCB
  • Metal Core PCB
    • Aluminium PCB
    • Copper PCB
  • Ceramic PCB
  • Laser Stencil
  • Reverse engineering
  • Purchasing components

Links

Google.comBaidu.com

内页左侧广告1

Feedback

Contact Us

sales@key-pcba.com

234123644@qq.com

Commercial and Cultural Building, Community 11 of Tangwei,Fuhai Street, Bao'An District Shenzhen 518103 GuangDong China.

WECHAT

Copyright © 2016 KEY TECHNOLOGY(HK)CO. ,LIMITED All Rights Reserved.

  • Skype.
  • E-mail
  • Whatsapp
  • Inquiry