Blogs

The final inspection in the PCB (Printed Circuit Board) manufacturing process is a crucial stage to ensure product quality and compliance with design specifications.

The common types and characteristics of board materials for high-frequency PCBs, dielectric constant range,differences between the production of high-frequency PCB and ordinary FR4 PCB,key applications.

the gold wire cannot be hit, nickel-palladium-gold plating. How can we ensure that there is no such slight stain on the plating after welding?

"Blind via aspect ratio" is commonly interpreted as "the aspect ratio of blind vias" or "the width-to-height ratio of blind vias".

How much does multi-layer PCB manufacturing cost?The manufacturing cost of a multi-layer PCB can be affected by a variety of factors, including the number of layers, board size, material quality, manufacturing process complexity, order quantity, factory location, etc.

Skills of manual soldering of chip electronic components

The solder paste printing process mainly solves the problem of solder paste printing consistency (filling and transfer), rather than the problem of solder paste demand for each solder joint. In other words, the solder paste printing process solves a problem of welding pass rate fluctuation, rather than a problem of high or low pass rate! To solve the problem of high or low pass rate, the key lies

Improper PCB layout are due to unreasonable PCB Conductor Width, Unreasonable PCB Routing Spacing, Unreasonable PCB Routing Direction, Failure to Route According to Functional Areas