Description
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In PCB reverse engineering, the following instruments may be used:
- 3D X-RAY: It is used to detect the internal structure of the PCB, including blind and buried holes, circuit routing, etc.
- EDS (Energy Dispersive Spectroscopy): It is used to analyze the elemental composition on the surface of the PCB.
- SEM (Scanning Electron Microscope) analyzer: It is used to observe the surface morphology and microstructure of the PCB.
- 3D microscope: It can see the distribution of the inner layer structure of the PCB in real time.
- Magnetoresistive thickness gauge: It is used to measure the coating thickness on the PCB, such as paint, plastic, enamel, etc.
- High-precision image measuring instrument: It is used to measure the external dimensions, aperture size, line width and spacing, etc. of the PCB.
