Description
layers 1-layer,
board thick 0.8+/-0.1mm,
plate 96%AL2O3,
min hole 0.8mm,
surface finish ENIG,
Thermal conductivity of insulation layer 30W,
out layer copper thick:70um,
Au >=3u"
technology charactors: through hole, dpc technology
The manufacturing process of aluminum oxide ceramic PCB mainly includes single-sintering multi-layer method and thick film multi-layer method. The simple process flows of these two methods are as follows:
I. Single-sintering multi-layer method:
1. Stamping of ceramic blank;
2. Printing of conductive layer;
3. Laminating or printing of insulation layer;
4. Blanking of external shape;
5. Sintering;
6. Plating of precious metals.
II. Thick film multi-layer method:
1. Stamping of ceramic blank;
2. Sintering;
3. Printing of conductive layer;
4. Sintering;
5. Printing of insulation layer;
6. Printing of conductive layer;
7. Sintering (operating back and forth according to the number of layers).
