Description
Rogers taconic pcb
Number of floors: 4
Plate thickness: 2.0 ± 0.14mm
Plate used:Taconic+FR4
size:210mm*230mm
Minimum hole diameter: 0.3mm
Surface treatment:immersion gold
Minimum trace width/distance: 0.18mm/0.2mm
Process characteristics: high-frequency materials, Taconic+FR4 Shengyi mixed lamination
Application field: communication
Characteristics of High frequency mixed board: stepped blind slot design
The production process of Taconic PCB includes the following steps:
1. Material Cutting (CUT): Cutting the original copper-clad laminate into boards that can be fabricated on the production line.
2. Inner Dry Film (INNER DRY FILM): Through multiple processes such as film pasting, exposure and development, and inner etching, the inner circuit pattern is transferred to the PCB.
3. Browning: Making the inner copper surface form a microscopic roughness and an organic metal layer to enhance the adhesion between layers.
4. Lamination: Bonding each layer of circuits into a whole with the adhesiveness of the pp sheet.
5. Drilling: Creating through-holes between the layers of the circuit board to achieve the purpose of connecting the layers.
6. Copper Deposition and Plate Electroplating: Including copper deposition and plate electroplating to metallize the holes and thicken the copper layer.
7. Outer Dry Film: Similar to the inner dry film process.
8. Outer Pattern Electroplating and SES: Increasing the copper layer of the holes and circuits to a certain thickness and etching away the useless copper.
9. Solder Resist: Preventing short circuits during soldering by screen printing or coating solder resist ink.
10. Silk-screen Character: Printing the required words, trademarks or component symbols on the board surface.
11. Surface Treatment: Ensuring good solderability or electrical performance.
12. Shaping: Cutting the PCB into the required shape and size.
13. Electrical Test: Checking the electrical performance of the board.
14. Final Inspection, Random Inspection and Packaging: Checking the appearance, size, hole diameter, board thickness, etc. of the board.
